PART |
Description |
Maker |
EPC-1300-0.5-4 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-880-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-525-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-525-0.5 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-470-0.5 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-440-2.5 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-440-1.4 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-1300-0.22-2 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-1300-0.22-3 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-1300-1.0-3 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
S5106 S5107 S7509 S7510 |
Si PIN photodiode Chip carrier package for surface mount
|
Hamamatsu Corporation
|
S8865-64 |
Photodiode array combined with signal processing circuit chip 光电二极管阵列结合信号处理集成电路芯
|
Hamamatsu Photonics K.K.
|